Thermal management Archives - Hauber & Graf Electronics GmbH

Thermal management in power electronics

There are various methods for dissipating heat from electronic components and circuit boards. The smaller and more complex the components are, the more important heat dissipation is in order to extend the service life of the individual components. We have various manufacturers and service providers who have tackled this problem and developed very good methods.

Interface materials

AISMALIBAR’s insulated metal substrates enable processing with standard PCB processes and integrate heat dissipation without additional components and SMD assembly process.
Thick aluminum-based substrate laminated with ED copper foil.
Designed for effective heat dissipation and high electrical insulation.
Our specially formulated polymer ceramic ensures high thermal conductivity, dielectric strength and thermal resistance.

ZFW - Simulation and measurement

Thermal management in electronics

Services / Project examples

Thermal simulation calculation
Thermal analysis
Thermal measurements
Product development

Measuring & laboratory equipment

Nano-Flash
Calorimeter
Thermal camera
Thermal tester
Wind tunnel

widap - Heat sink

Bar press profiles, standard and customized, water cooling,
high performance, pinbloc, special solutions